
Description ASM Pacific Technology Limited, an investment holding company, engages in the research and development, design, manufacture, and marketing of machines, tools, and materials used in the semiconductor industry; and surface mount technology placement machines. The company operates through three segments: Back-end Equipment, Surface Mount Technology Equipment, and Lead Frame. It provides sorting solutions, die bonders, flip chip bonders, ball bonders, wedge bonders, dispensing/encapsulation and post encapsulation systems, test and finish solutions, factory automation solutions, and lead frame solutions. The company also offers copper bonding, stacked die, LED, advanced fine pitch, and image sensor in-line assembly solutions; and support services. In addition, it is involved in the trade of semiconductor materials and surface mount technology equipment; and the provision of research and development, and marketing services. The company was founded in 1975 and is based in Kwai Chung, Hong Kong. ASM Pacific Technology Limited is a subsidiary of ASM Pacific Holding B.V. To view the detailed information, you need to SUBSCRIBE with us. |
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